Enterprise-class 4Gbps Fibre Channel storage area network (SAN) switch blade featuring up to 24 ports, engineered to provide high-bandwidth embedded fabric routing for HP BladeSystem c-Class enclosures.
Enterprise-class internal server motherboard featuring an Intel LGA1156 processor socket and high-density DDR3 memory routing, engineered to restore full processing logic to IBM System x3250 M3 server arrays.
High-efficiency internal copper-core aluminum cooling heatsink, engineered to provide rapid thermal dissipation for high-wattage Intel Xeon processors in IBM System x3650 M4 servers.
Enterprise-class 4GB DDR3 server memory module operating at 1333MHz, engineered with ECC error correction and registered buffering to provide high-availability stability for HP ProLiant arrays.
Enterprise-class 1GB DDR3 unbuffered server memory module operating at 1333MHz, engineered with ECC data correction to deliver reliable, high-speed stability for HP ProLiant platforms.
Enterprise-class 4GB DDR3 server memory module operating at 1066MHz, engineered with ECC error correction and registered buffering to provide high-availability stability for HP ProLiant arrays.
Enterprise-class 8GB DDR3 Low Power server memory module operating at 1333MHz, engineered with ECC error correction and registered buffering to optimize thermal efficiency in HP ProLiant systems.
Enterprise-class 2GB DDR2 server memory module operating at 400MHz, engineered with ECC data correction and registered buffering to ensure high-availability performance in legacy HP ProLiant servers.
Enterprise-class internal storage backplane board, engineered to route power and high-speed SAS/SATA data signals for hot-swap 3.5-inch Large Form Factor (LFF) hard drive bays.
Enterprise-class 1GB internal SDRAM memory module, engineered to deliver stable data processing and high-availability error correction for legacy Sun SPARC architecture nodes.
Enterprise-class 2GB DDR2 dual-rank memory module, engineered to deliver reliable data throughput and error correction for mission-critical Sun SPARC enterprise systems.
High-availability 2GB DDR3 server memory module operating at 1333MHz, engineered with ECC data correction and a low-profile layout to maximize computing density in IBM System x arrays.
Enterprise-grade internal server motherboard architecture featuring dual Intel LGA1366 processor sockets and dense DDR3 memory channels, engineered to restore full processing logic to IBM System x3550 M2 arrays.
High-speed 300GB enterprise hard drive operating at 15,000 RPM with a 6Gbps SAS interface, engineered to deliver ultra-low latency and maximum I/O processing performance for System x servers.
Enterprise-class 2Gbps Fibre Channel storage area network (SAN) switch featuring 16 active ports, engineered to provide high-bandwidth, reliable data fabric routing for legacy fabric storage networks.
High-velocity internal processor dual-fan cooling tray assembly, engineered to maintain optimal volumetric airflow and thermal regulation for high-density Sun Fire V490 CPU modules.
Enterprise-class 2-slot internal hot-swap SATA hard drive backplane board, engineered to manage data routing and power distribution for Dell PowerEdge M-Series blade servers.
Enterprise-class SAS 6/iR internal storage controller card, engineered to provide high-bandwidth Serial Attached SCSI (SAS) and SATA drive connectivity with integrated RAID data protection for Dell PowerEdge servers.
Enterprise-class 488-Watt hot-swappable AC power supply unit, engineered to deliver reliable, redundant power distribution for multi-core Dell PowerEdge servers.
