Enterprise-grade internal system communication cable, engineered to link the Frame Interface Control (FIC) board with the Operator Panel Controller (OPC) card in IBM tape libraries.
Enterprise-grade internal mechanical robotics pivot assembly, engineered to facilitate fluid, precise rotational tracking for the robotic cartridge accessor in IBM automated tape libraries.
Enterprise-grade internal electrical power distribution cable, engineered to deliver stable, direct power from the distribution mainboard to Frame Control (FIC) assemblies in select IBM systems.
Enterprise-grade internal system communication interface card, engineered to manage cross-communication and library control signals between components within IBM TotalStorage enclosures.
Enterprise-grade internal safety control harness, integrating a Unit Emergency Power Off (UEPO) switch and diagnostic LED wiring interface for IBM TotalStorage frames.
Enterprise-grade internal power distribution unit (PDU) assembly, configured with a dual line cord design to supply redundant, balanced electrical feeds to IBM TotalStorage frames.
Enterprise-grade 290W internal direct-current power supply module, engineered with a 37V DC output layout to deliver dedicated, reliable power for IBM UltraScalable tape libraries.
Enterprise-grade internal safety door interlock sensor switch, engineered as a core base kit component to cut power or alert systems when chassis service panels are detached.
Enterprise-grade 4GB PC3-10600 DDR3-1333MHz dual-rank memory module, engineered with ECC Registered technology to deliver high data integrity for IBM System x servers.
Enterprise-grade 1GB PC3-10600 DDR3-1333MHz single-rank low-profile memory module, engineered with ECC Registered technology to deliver high data integrity for IBM System x servers.
Enterprise-grade 2GB PC3-10600 DDR3-1333MHz dual-rank low-profile memory module, engineered with ECC Registered technology to deliver high data integrity for IBM System x servers.
Enterprise-grade internal hot-swappable dual-rotor cooling fan assembly, engineered to deliver focused thermal regulation and high static pressure for IBM System x3650 M3 servers.
Enterprise-grade 675W hot-swappable internal AC power supply module, engineered to deliver continuous, redundant electricity to IBM System x3650 and x3550 M1 server arrays.
Enterprise-class internal hot-swap power distribution backplane board, engineered to route and regulate electrical power pathways from the power supplies to the IBM System x3550 M3 core logic.
Enterprise-grade internal cooling fan cage assembly featuring an integrated distribution board, engineered to structure and power the primary thermal management array in IBM System x3550 M3 servers.
Enterprise-class internal PCI Express x16 expansion riser board, engineered to redirect high-bandwidth expansion interface lanes within low-profile IBM System x3550 M3 server chassis.
Enterprise-class 2.5-inch small form factor (SFF) internal hard drive backplane board, engineered to distribute data and power pathways for up to four hot-swap drives in IBM System x3550 M4 servers.
Enterprise-class PCIe x8 SAS/SATA RAID controller card featuring 6Gbps per port throughput, engineered to provide hardware data redundancy and high-speed storage management for IBM System x servers.
Enterprise-grade 675W hot-swappable internal AC power supply module, engineered to deliver continuous, redundant electricity to IBM System x3650 and x3550 M1 server arrays.
High-efficiency internal copper-core aluminum cooling heatsink, engineered to provide rapid thermal dissipation for high-wattage Intel Xeon processors in IBM System x3650 M4 servers.
